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RELIFE RL-044 58PCS Chip Planting Tin Steel Mesh Set for Android Qualcomm Snapdragon Dimensity HiSilicon BGA Reballing Stencil RELIFE RL-044 58PCS Chip Planting Tin Steel Mesh Set for Android Qualcomm Snapdragon Dimensity HiSilicon BGA Reballing Stencil

RELIFE RL-044 58PCS Chip Planting Tin Steel Mesh Set for Android Qualcomm Snapdragon Dimensity HiSilicon BGA Reballing Stencil

$195.70$195.70

8 sold
15% off
AMAOE Universal CPU Reballing Stencil Template Station for Qualcomm SM8750 SM6450 BGA496 IC Chip Rework Motherboard Repair Tools AMAOE Universal CPU Reballing Stencil Template Station for Qualcomm SM8750 SM6450 BGA496 IC Chip Rework Motherboard Repair Tools

AMAOE Universal CPU Reballing Stencil Template Station for Qualcomm SM8750 SM6450 BGA496 IC Chip Rework Motherboard Repair Tools

$9.73$11.45

3 sold
Amaoe 8PCS/Set QU1 QU2 QU3 QU4 QU5 QU6 QU7 QU8 BGA Reballing Stencil Kit for Qualcomm Series CPU RAM Steel Mesh Amaoe 8PCS/Set QU1 QU2 QU3 QU4 QU5 QU6 QU7 QU8 BGA Reballing Stencil Kit for Qualcomm Series CPU RAM Steel Mesh

Amaoe 8PCS/Set QU1 QU2 QU3 QU4 QU5 QU6 QU7 QU8 BGA Reballing Stencil Kit for Qualcomm Series CPU RAM Steel Mesh

$188.49$188.49

2 sold
Micro USB RJ45 All in 1 Boot Cable for Qualcomm EDL/DFC/9008 Mode Support Fast Charge MTK/SPD Box Octopus Box Dongle USB Adapter Micro USB RJ45 All in 1 Boot Cable for Qualcomm EDL/DFC/9008 Mode Support Fast Charge MTK/SPD Box Octopus Box Dongle USB Adapter

Micro USB RJ45 All in 1 Boot Cable for Qualcomm EDL/DFC/9008 Mode Support Fast Charge MTK/SPD Box Octopus Box Dongle USB Adapter

$18.44$18.44

6 sold
50% off
JTX T4 Max Glue Removal Tin Planting Platform with Qualcomm HiSilicon IP Tin Reballing Stencil for Phone IC Chip Repair Clamp JTX T4 Max Glue Removal Tin Planting Platform with Qualcomm HiSilicon IP Tin Reballing Stencil for Phone IC Chip Repair Clamp

JTX T4 Max Glue Removal Tin Planting Platform with Qualcomm HiSilicon IP Tin Reballing Stencil for Phone IC Chip Repair Clamp

$24.84$49.68

9 sold
45% off
JTX T4 Universal CPU BGA reballing holder fixture with 13Pcs BGA stencil for Exynos EMMC iPhone Hisilicon Qualcomm Dimensity JTX T4 Universal CPU BGA reballing holder fixture with 13Pcs BGA stencil for Exynos EMMC iPhone Hisilicon Qualcomm Dimensity

JTX T4 Universal CPU BGA reballing holder fixture with 13Pcs BGA stencil for Exynos EMMC iPhone Hisilicon Qualcomm Dimensity

$22.79$41.43

1 sold
50% off
Latest W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool Latest W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool

Latest W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool

$60.17$120.35

3% off
RELIFE RL-044 58Pcs Android CPU Series Chip Planting Tin Steel Stencil Set For Qualcomm Snapdragon EMMC BGA Planting Tin Repair RELIFE RL-044 58Pcs Android CPU Series Chip Planting Tin Steel Stencil Set For Qualcomm Snapdragon EMMC BGA Planting Tin Repair

RELIFE RL-044 58Pcs Android CPU Series Chip Planting Tin Steel Stencil Set For Qualcomm Snapdragon EMMC BGA Planting Tin Repair

$199.82$206.00

11 sold
YCS BGA Chip Temporary IC Planting Tin Steel Mesh For iPhone Qualcomm HiSilicon MediaTek Samsung CPU Tin Planting Station Set YCS BGA Chip Temporary IC Planting Tin Steel Mesh For iPhone Qualcomm HiSilicon MediaTek Samsung CPU Tin Planting Station Set

YCS BGA Chip Temporary IC Planting Tin Steel Mesh For iPhone Qualcomm HiSilicon MediaTek Samsung CPU Tin Planting Station Set

$2.62$2.62

11 sold
65% off
Universal BGA Stencil Set Direct Heating Template For CPU DDR RAM Repair Tool For For iPhone Qualcomm Chip Solder Reballing Universal BGA Stencil Set Direct Heating Template For CPU DDR RAM Repair Tool For For iPhone Qualcomm Chip Solder Reballing

Universal BGA Stencil Set Direct Heating Template For CPU DDR RAM Repair Tool For For iPhone Qualcomm Chip Solder Reballing

$133.86$382.46

49% off
NEW W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool NEW W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool

NEW W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool

$53.46$106.91

3% off
10PCS Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh CPU BGA Reballing Stencil Kit 10PCS Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh CPU BGA Reballing Stencil Kit

10PCS Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh CPU BGA Reballing Stencil Kit

$229.79$236.90

5 sold
2UUL BH16 Magnetic Dual-Sided NAND Reballing Platform Set For iPhone Android EMMC Qualcomm Hisilicon NAND Flash Chip Repair Tool 2UUL BH16 Magnetic Dual-Sided NAND Reballing Platform Set For iPhone Android EMMC Qualcomm Hisilicon NAND Flash Chip Repair Tool

2UUL BH16 Magnetic Dual-Sided NAND Reballing Platform Set For iPhone Android EMMC Qualcomm Hisilicon NAND Flash Chip Repair Tool

$14.99$14.99

1 sold
68% off
Direct Heat BGA Stencil Set For CPU DDR RAM Repair Template For For iPhone For Qualcomm FOP Chip Soldering Reballing Work Tool Direct Heat BGA Stencil Set For CPU DDR RAM Repair Template For For iPhone For Qualcomm FOP Chip Soldering Reballing Work Tool

Direct Heat BGA Stencil Set For CPU DDR RAM Repair Template For For iPhone For Qualcomm FOP Chip Soldering Reballing Work Tool

$133.86$418.31

RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity

RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity

$30.98$30.98

10 sold
55% off
Direct Heat BGA Stencil Set For CPU DDR RAM Repair Template For For iPhone Qualcomm FOP Chip Solder Reballing Accessory Kit Direct Heat BGA Stencil Set For CPU DDR RAM Repair Template For For iPhone Qualcomm FOP Chip Solder Reballing Accessory Kit

Direct Heat BGA Stencil Set For CPU DDR RAM Repair Template For For iPhone Qualcomm FOP Chip Solder Reballing Accessory Kit

$133.86$297.47

65% off
Direct Heating BGA Stencil Set For CPU DDR RAM Repairing Template For For iPhone For Qualcomm FOP Chip Solder Reballing Station Direct Heating BGA Stencil Set For CPU DDR RAM Repairing Template For For iPhone For Qualcomm FOP Chip Solder Reballing Station

Direct Heating BGA Stencil Set For CPU DDR RAM Repairing Template For For iPhone For Qualcomm FOP Chip Solder Reballing Station

$133.86$382.46

MECHANIC 9pcs UFO Composite Stencils Set for Qualcomm MTK CPU Reballing Stencil Chip BGA Square Hole Tin Planting Steel Mesh MECHANIC 9pcs UFO Composite Stencils Set for Qualcomm MTK CPU Reballing Stencil Chip BGA Square Hole Tin Planting Steel Mesh

MECHANIC 9pcs UFO Composite Stencils Set for Qualcomm MTK CPU Reballing Stencil Chip BGA Square Hole Tin Planting Steel Mesh

$17.64$17.64

74 sold
Amao MIXU3 BGA Reballing Stencil for Qualcomm SM8850/7750/8735/8845 and MediaTek MT6993Z/6899Z/6858V Amao MIXU3 BGA Reballing Stencil for Qualcomm SM8850/7750/8735/8845 and MediaTek MT6993Z/6899Z/6858V

Amao MIXU3 BGA Reballing Stencil for Qualcomm SM8850/7750/8735/8845 and MediaTek MT6993Z/6899Z/6858V

$15.00$15.00

28% off
MaAnt C1 Tin Planting Net Platform Steel Mesh for iPhone 6-17 Pro Max CPU Qualcomm Hisilicon Samsung CPU Soldering Repair Tools MaAnt C1 Tin Planting Net Platform Steel Mesh for iPhone 6-17 Pro Max CPU Qualcomm Hisilicon Samsung CPU Soldering Repair Tools

MaAnt C1 Tin Planting Net Platform Steel Mesh for iPhone 6-17 Pro Max CPU Qualcomm Hisilicon Samsung CPU Soldering Repair Tools

$12.24$17.00

49% off
【SSummer10】W230 W231 W232 Universal EDL Cable - Qualcomm Flash 9008 Port Engineering Line for Redmi Phone Repair Tool【SS】 【SSummer10】W230 W231 W232 Universal EDL Cable - Qualcomm Flash 9008 Port Engineering Line for Redmi Phone Repair Tool【SS】

【SSummer10】W230 W231 W232 Universal EDL Cable - Qualcomm Flash 9008 Port Engineering Line for Redmi Phone Repair Tool【SS】

$56.16$112.31

6 sold
39% off
Mijing Z21 MAX CPU BGA Reballing Stencil Platform for iPhone 6-17 Pro Android Qualcomm Snapdragon IC Chip Planting Tin Templat Mijing Z21 MAX CPU BGA Reballing Stencil Platform for iPhone 6-17 Pro Android Qualcomm Snapdragon IC Chip Planting Tin Templat

Mijing Z21 MAX CPU BGA Reballing Stencil Platform for iPhone 6-17 Pro Android Qualcomm Snapdragon IC Chip Planting Tin Templat

$1.01$1.65

8 sold
50% off
MaAnt C1 BGA Reballing Stencil Platform Set for IP A8-A17 MTK Hisilicon Qualcomm EMMC SAM CPU Planting Tin Steel Mesh MaAnt C1 BGA Reballing Stencil Platform Set for IP A8-A17 MTK Hisilicon Qualcomm EMMC SAM CPU Planting Tin Steel Mesh

MaAnt C1 BGA Reballing Stencil Platform Set for IP A8-A17 MTK Hisilicon Qualcomm EMMC SAM CPU Planting Tin Steel Mesh

$109.90$219.80

5 sold
20% off
AMAOE BGA stencil for Qualcomm Snapdragon 778G/665/720G/7Gen1/460/662/750G/680/775G/SM7350/SM6225/SM7225/SM6115/SM4250/SM7450

AMAOE BGA stencil for Qualcomm Snapdragon 778G/665/720G/7Gen1/460/662/750G/680/775G/SM7350/SM6225/SM7225/SM6115/SM4250/SM7450

$5.52$6.90

11 sold
MAant C1 Magnet Tin Planting Platform For iPhone A8-A19 QUALCOMM HS EMMC Motherboard CPU BGA Welding Reballing Stencil Tools Set MAant C1 Magnet Tin Planting Platform For iPhone A8-A19 QUALCOMM HS EMMC Motherboard CPU BGA Welding Reballing Stencil Tools Set

MAant C1 Magnet Tin Planting Platform For iPhone A8-A19 QUALCOMM HS EMMC Motherboard CPU BGA Welding Reballing Stencil Tools Set

$145.70$145.70

7 sold
ADAU1701 DSP Bluetooth Amplifier Board 5.0 4x30W Support 4.0/2.1/2.0 Max 120W Qualcomm Bluetooth 5.0 Chip HIFI Audio System 4.2 ADAU1701 DSP Bluetooth Amplifier Board 5.0 4x30W Support 4.0/2.1/2.0 Max 120W Qualcomm Bluetooth 5.0 Chip HIFI Audio System 4.2

ADAU1701 DSP Bluetooth Amplifier Board 5.0 4x30W Support 4.0/2.1/2.0 Max 120W Qualcomm Bluetooth 5.0 Chip HIFI Audio System 4.2

$275.22$275.22

50% off
W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool

W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool

$57.97$115.95

1 sold
46% off
AMAOE QU1-8 BGA Reballing Stencil for Qualcomm MSM SM SDM Snapdragon CPU Planting Tin Steel Mesh Set AMAOE QU1-8 BGA Reballing Stencil for Qualcomm MSM SM SDM Snapdragon CPU Planting Tin Steel Mesh Set

AMAOE QU1-8 BGA Reballing Stencil for Qualcomm MSM SM SDM Snapdragon CPU Planting Tin Steel Mesh Set

$41.30$76.53

5 sold
55% off
Universal BGA Stencil Kit Direct Heating Template For CPU DDR Memory Reballing For For iPhone For Qualcomm Chip Repairing Tool Universal BGA Stencil Kit Direct Heating Template For CPU DDR Memory Reballing For For iPhone For Qualcomm Chip Repairing Tool

Universal BGA Stencil Kit Direct Heating Template For CPU DDR Memory Reballing For For iPhone For Qualcomm Chip Repairing Tool

$133.86$297.47

MECHANIC UFO Composite Stencils Set for Qualcomm MTK CPU Reballing Stencil Chip BGA Square Hole Tin Planting Steel Mesh Tools MECHANIC UFO Composite Stencils Set for Qualcomm MTK CPU Reballing Stencil Chip BGA Square Hole Tin Planting Steel Mesh Tools

MECHANIC UFO Composite Stencils Set for Qualcomm MTK CPU Reballing Stencil Chip BGA Square Hole Tin Planting Steel Mesh Tools

$17.75$17.75

10 sold
25% off
XINZHIZAO XZZ L23 CPU Universal Tin Planting Platform for A8-A16 MTK Hisilicon Qualcomm 0.12mm BGA Reballing Stencil Steel Mesh XINZHIZAO XZZ L23 CPU Universal Tin Planting Platform for A8-A16 MTK Hisilicon Qualcomm 0.12mm BGA Reballing Stencil Steel Mesh

XINZHIZAO XZZ L23 CPU Universal Tin Planting Platform for A8-A16 MTK Hisilicon Qualcomm 0.12mm BGA Reballing Stencil Steel Mesh

$6.49$8.65

50% off
RELIFE RL-044 58PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm RELIFE RL-044 58PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm

RELIFE RL-044 58PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm

$42.88$85.76

8 sold
50% off
Amaoe U-QSD12 Reballing Stencil for Qualcomm 7sGen3/7Gen3/6Gen1/4Gen2, SM7635/SM7550/SM6450/SM4450 IC Planting Tin Steel Mesh Amaoe U-QSD12 Reballing Stencil for Qualcomm 7sGen3/7Gen3/6Gen1/4Gen2, SM7635/SM7550/SM6450/SM4450 IC Planting Tin Steel Mesh

Amaoe U-QSD12 Reballing Stencil for Qualcomm 7sGen3/7Gen3/6Gen1/4Gen2, SM7635/SM7550/SM6450/SM4450 IC Planting Tin Steel Mesh

$5.32$10.65

4 sold
2UUL BH16 Magnetic Dual-Sided NAND Reballing Platform Set for IPhone Android EMMC Qualcomm Hisilicon NAND Flash Chip Repair Tool 2UUL BH16 Magnetic Dual-Sided NAND Reballing Platform Set for IPhone Android EMMC Qualcomm Hisilicon NAND Flash Chip Repair Tool

2UUL BH16 Magnetic Dual-Sided NAND Reballing Platform Set for IPhone Android EMMC Qualcomm Hisilicon NAND Flash Chip Repair Tool

$20.58$20.58

8 sold
68% off
BGA Reballing Stencil Template Set Direct Heat For CPU DDR RAM Repair Tool For For iPhone Qualcomm Chip Soldering Station Kit BGA Reballing Stencil Template Set Direct Heat For CPU DDR RAM Repair Tool For For iPhone Qualcomm Chip Soldering Station Kit

BGA Reballing Stencil Template Set Direct Heat For CPU DDR RAM Repair Tool For For iPhone Qualcomm Chip Soldering Station Kit

$133.86$418.31

3% off
MaAnt C1 BGA Reballing Stencil Platform For iPhone A8-A19 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair Tools Set MaAnt C1 BGA Reballing Stencil Platform For iPhone A8-A19 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair Tools Set

MaAnt C1 BGA Reballing Stencil Platform For iPhone A8-A19 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair Tools Set

$77.93$80.34

2 sold
RELIFE RL-044 58PCS Chip Planting Tin Steel Mesh Set for Android Qualcomm Snapdragon Dimensity HiSilicon BGA Reballing Stencil RELIFE RL-044 58PCS Chip Planting Tin Steel Mesh Set for Android Qualcomm Snapdragon Dimensity HiSilicon BGA Reballing Stencil

RELIFE RL-044 58PCS Chip Planting Tin Steel Mesh Set for Android Qualcomm Snapdragon Dimensity HiSilicon BGA Reballing Stencil

$195.70 $195.70

8 sold

Categories: Tools, Tool Sets

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15% off
AMAOE Universal CPU Reballing Stencil Template Station for Qualcomm SM8750 SM6450 BGA496 IC Chip Rework Motherboard Repair Tools AMAOE Universal CPU Reballing Stencil Template Station for Qualcomm SM8750 SM6450 BGA496 IC Chip Rework Motherboard Repair Tools

AMAOE Universal CPU Reballing Stencil Template Station for Qualcomm SM8750 SM6450 BGA496 IC Chip Rework Motherboard Repair Tools

$9.73 $11.45

3 sold

Categories: Tools, Tool Sets

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Amaoe 8PCS/Set QU1 QU2 QU3 QU4 QU5 QU6 QU7 QU8 BGA Reballing Stencil Kit for Qualcomm Series CPU RAM Steel Mesh Amaoe 8PCS/Set QU1 QU2 QU3 QU4 QU5 QU6 QU7 QU8 BGA Reballing Stencil Kit for Qualcomm Series CPU RAM Steel Mesh

Amaoe 8PCS/Set QU1 QU2 QU3 QU4 QU5 QU6 QU7 QU8 BGA Reballing Stencil Kit for Qualcomm Series CPU RAM Steel Mesh

$188.49 $188.49

2 sold

Categories: Tools, Tool Sets

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Micro USB RJ45 All in 1 Boot Cable for Qualcomm EDL/DFC/9008 Mode Support Fast Charge MTK/SPD Box Octopus Box Dongle USB Adapter Micro USB RJ45 All in 1 Boot Cable for Qualcomm EDL/DFC/9008 Mode Support Fast Charge MTK/SPD Box Octopus Box Dongle USB Adapter

Micro USB RJ45 All in 1 Boot Cable for Qualcomm EDL/DFC/9008 Mode Support Fast Charge MTK/SPD Box Octopus Box Dongle USB Adapter

$18.44 $18.44

6 sold

Categories: Tools, Tool Sets

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50% off
JTX T4 Max Glue Removal Tin Planting Platform with Qualcomm HiSilicon IP Tin Reballing Stencil for Phone IC Chip Repair Clamp JTX T4 Max Glue Removal Tin Planting Platform with Qualcomm HiSilicon IP Tin Reballing Stencil for Phone IC Chip Repair Clamp

JTX T4 Max Glue Removal Tin Planting Platform with Qualcomm HiSilicon IP Tin Reballing Stencil for Phone IC Chip Repair Clamp

$24.84 $49.68

9 sold

Categories: Tools, Tool Sets

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45% off
JTX T4 Universal CPU BGA reballing holder fixture with 13Pcs BGA stencil for Exynos EMMC iPhone Hisilicon Qualcomm Dimensity JTX T4 Universal CPU BGA reballing holder fixture with 13Pcs BGA stencil for Exynos EMMC iPhone Hisilicon Qualcomm Dimensity

JTX T4 Universal CPU BGA reballing holder fixture with 13Pcs BGA stencil for Exynos EMMC iPhone Hisilicon Qualcomm Dimensity

$22.79 $41.43

1 sold

Categories: Tools, Tool Sets

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50% off
Latest W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool Latest W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool

Latest W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool

$60.17 $120.35

Categories: Tools, Tool Sets

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3% off
RELIFE RL-044 58Pcs Android CPU Series Chip Planting Tin Steel Stencil Set For Qualcomm Snapdragon EMMC BGA Planting Tin Repair RELIFE RL-044 58Pcs Android CPU Series Chip Planting Tin Steel Stencil Set For Qualcomm Snapdragon EMMC BGA Planting Tin Repair

RELIFE RL-044 58Pcs Android CPU Series Chip Planting Tin Steel Stencil Set For Qualcomm Snapdragon EMMC BGA Planting Tin Repair

$199.82 $206.00

11 sold

Categories: Tools, Tool Sets

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YCS BGA Chip Temporary IC Planting Tin Steel Mesh For iPhone Qualcomm HiSilicon MediaTek Samsung CPU Tin Planting Station Set YCS BGA Chip Temporary IC Planting Tin Steel Mesh For iPhone Qualcomm HiSilicon MediaTek Samsung CPU Tin Planting Station Set

YCS BGA Chip Temporary IC Planting Tin Steel Mesh For iPhone Qualcomm HiSilicon MediaTek Samsung CPU Tin Planting Station Set

$2.62 $2.62

11 sold

Categories: Tools, Tool Sets

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65% off
Universal BGA Stencil Set Direct Heating Template For CPU DDR RAM Repair Tool For For iPhone Qualcomm Chip Solder Reballing Universal BGA Stencil Set Direct Heating Template For CPU DDR RAM Repair Tool For For iPhone Qualcomm Chip Solder Reballing

Universal BGA Stencil Set Direct Heating Template For CPU DDR RAM Repair Tool For For iPhone Qualcomm Chip Solder Reballing

$133.86 $382.46

Categories: Tools, Tool Sets

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49% off
NEW W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool NEW W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool

NEW W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool

$53.46 $106.91

Categories: Tools, Tool Sets

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3% off
10PCS Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh CPU BGA Reballing Stencil Kit 10PCS Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh CPU BGA Reballing Stencil Kit

10PCS Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh CPU BGA Reballing Stencil Kit

$229.79 $236.90

5 sold

Categories: Tools, Tool Sets

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2UUL BH16 Magnetic Dual-Sided NAND Reballing Platform Set For iPhone Android EMMC Qualcomm Hisilicon NAND Flash Chip Repair Tool 2UUL BH16 Magnetic Dual-Sided NAND Reballing Platform Set For iPhone Android EMMC Qualcomm Hisilicon NAND Flash Chip Repair Tool

2UUL BH16 Magnetic Dual-Sided NAND Reballing Platform Set For iPhone Android EMMC Qualcomm Hisilicon NAND Flash Chip Repair Tool

$14.99 $14.99

1 sold

Categories: Tools, Tool Sets

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68% off
Direct Heat BGA Stencil Set For CPU DDR RAM Repair Template For For iPhone For Qualcomm FOP Chip Soldering Reballing Work Tool Direct Heat BGA Stencil Set For CPU DDR RAM Repair Template For For iPhone For Qualcomm FOP Chip Soldering Reballing Work Tool

Direct Heat BGA Stencil Set For CPU DDR RAM Repair Template For For iPhone For Qualcomm FOP Chip Soldering Reballing Work Tool

$133.86 $418.31

Categories: Tools, Tool Sets

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RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity

RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity

$30.98 $30.98

10 sold

Categories: Tools, Tool Sets

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55% off
Direct Heat BGA Stencil Set For CPU DDR RAM Repair Template For For iPhone Qualcomm FOP Chip Solder Reballing Accessory Kit Direct Heat BGA Stencil Set For CPU DDR RAM Repair Template For For iPhone Qualcomm FOP Chip Solder Reballing Accessory Kit

Direct Heat BGA Stencil Set For CPU DDR RAM Repair Template For For iPhone Qualcomm FOP Chip Solder Reballing Accessory Kit

$133.86 $297.47

Categories: Tools, Tool Sets

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65% off
Direct Heating BGA Stencil Set For CPU DDR RAM Repairing Template For For iPhone For Qualcomm FOP Chip Solder Reballing Station Direct Heating BGA Stencil Set For CPU DDR RAM Repairing Template For For iPhone For Qualcomm FOP Chip Solder Reballing Station

Direct Heating BGA Stencil Set For CPU DDR RAM Repairing Template For For iPhone For Qualcomm FOP Chip Solder Reballing Station

$133.86 $382.46

Categories: Tools, Tool Sets

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MECHANIC 9pcs UFO Composite Stencils Set for Qualcomm MTK CPU Reballing Stencil Chip BGA Square Hole Tin Planting Steel Mesh MECHANIC 9pcs UFO Composite Stencils Set for Qualcomm MTK CPU Reballing Stencil Chip BGA Square Hole Tin Planting Steel Mesh

MECHANIC 9pcs UFO Composite Stencils Set for Qualcomm MTK CPU Reballing Stencil Chip BGA Square Hole Tin Planting Steel Mesh

$17.64 $17.64

74 sold

Categories: Tools, Tool Sets

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Amao MIXU3 BGA Reballing Stencil for Qualcomm SM8850/7750/8735/8845 and MediaTek MT6993Z/6899Z/6858V Amao MIXU3 BGA Reballing Stencil for Qualcomm SM8850/7750/8735/8845 and MediaTek MT6993Z/6899Z/6858V

Amao MIXU3 BGA Reballing Stencil for Qualcomm SM8850/7750/8735/8845 and MediaTek MT6993Z/6899Z/6858V

$15.00 $15.00

Categories: Tools, Tool Sets

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28% off
MaAnt C1 Tin Planting Net Platform Steel Mesh for iPhone 6-17 Pro Max CPU Qualcomm Hisilicon Samsung CPU Soldering Repair Tools MaAnt C1 Tin Planting Net Platform Steel Mesh for iPhone 6-17 Pro Max CPU Qualcomm Hisilicon Samsung CPU Soldering Repair Tools

MaAnt C1 Tin Planting Net Platform Steel Mesh for iPhone 6-17 Pro Max CPU Qualcomm Hisilicon Samsung CPU Soldering Repair Tools

$12.24 $17.00

Categories: Tools, Tool Sets

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49% off
【SSummer10】W230 W231 W232 Universal EDL Cable - Qualcomm Flash 9008 Port Engineering Line for Redmi Phone Repair Tool【SS】 【SSummer10】W230 W231 W232 Universal EDL Cable - Qualcomm Flash 9008 Port Engineering Line for Redmi Phone Repair Tool【SS】

【SSummer10】W230 W231 W232 Universal EDL Cable - Qualcomm Flash 9008 Port Engineering Line for Redmi Phone Repair Tool【SS】

$56.16 $112.31

6 sold

Categories: Tools, Tool Sets

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39% off
Mijing Z21 MAX CPU BGA Reballing Stencil Platform for iPhone 6-17 Pro Android Qualcomm Snapdragon IC Chip Planting Tin Templat Mijing Z21 MAX CPU BGA Reballing Stencil Platform for iPhone 6-17 Pro Android Qualcomm Snapdragon IC Chip Planting Tin Templat

Mijing Z21 MAX CPU BGA Reballing Stencil Platform for iPhone 6-17 Pro Android Qualcomm Snapdragon IC Chip Planting Tin Templat

$1.01 $1.65

8 sold

Categories: Tools, Tool Sets

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50% off
MaAnt C1 BGA Reballing Stencil Platform Set for IP A8-A17 MTK Hisilicon Qualcomm EMMC SAM CPU Planting Tin Steel Mesh MaAnt C1 BGA Reballing Stencil Platform Set for IP A8-A17 MTK Hisilicon Qualcomm EMMC SAM CPU Planting Tin Steel Mesh

MaAnt C1 BGA Reballing Stencil Platform Set for IP A8-A17 MTK Hisilicon Qualcomm EMMC SAM CPU Planting Tin Steel Mesh

$109.90 $219.80

5 sold

Categories: Tools, Tool Sets

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20% off
AMAOE BGA stencil for Qualcomm Snapdragon 778G/665/720G/7Gen1/460/662/750G/680/775G/SM7350/SM6225/SM7225/SM6115/SM4250/SM7450

AMAOE BGA stencil for Qualcomm Snapdragon 778G/665/720G/7Gen1/460/662/750G/680/775G/SM7350/SM6225/SM7225/SM6115/SM4250/SM7450

$5.52 $6.90

11 sold

Categories: Tools, Tool Sets

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MAant C1 Magnet Tin Planting Platform For iPhone A8-A19 QUALCOMM HS EMMC Motherboard CPU BGA Welding Reballing Stencil Tools Set MAant C1 Magnet Tin Planting Platform For iPhone A8-A19 QUALCOMM HS EMMC Motherboard CPU BGA Welding Reballing Stencil Tools Set

MAant C1 Magnet Tin Planting Platform For iPhone A8-A19 QUALCOMM HS EMMC Motherboard CPU BGA Welding Reballing Stencil Tools Set

$145.70 $145.70

7 sold

Categories: Tools, Tool Sets

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ADAU1701 DSP Bluetooth Amplifier Board 5.0 4x30W Support 4.0/2.1/2.0 Max 120W Qualcomm Bluetooth 5.0 Chip HIFI Audio System 4.2 ADAU1701 DSP Bluetooth Amplifier Board 5.0 4x30W Support 4.0/2.1/2.0 Max 120W Qualcomm Bluetooth 5.0 Chip HIFI Audio System 4.2

ADAU1701 DSP Bluetooth Amplifier Board 5.0 4x30W Support 4.0/2.1/2.0 Max 120W Qualcomm Bluetooth 5.0 Chip HIFI Audio System 4.2

$275.22 $275.22

Categories: Tools, Tool Sets

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50% off
W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool

W230 W231 W232 Universal EDL Cable For Redmi Qualcomm Flash And Open For 9008 Port Engineering Line Phone Repair Tool

$57.97 $115.95

1 sold

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